Fehleranalyse

Accuracy and precision down to the nanometer for most demanding measuring tasks

Wafer Probing is the last QC operation at the front end of line (FEoL) and the probe card quality and state has a big impact on the wafer test results. Faulty pins (beams), bent probe heads and objects within the probe card clearance can negatively affect the wafer test or even bring damage to an already tested wafer.