SEMICAPS 1100

UPRIGHT ANALYTICAL SYSTEM

Features

• For backside and frontside analysis of wafers, wafer parts and packaged devices

• Ultra-stable system compatible for probing FIB pads

• Compatible with third-party probe stations, probe cards and manipulators

• CAD interface option

• Compatible with thermal management solutions

• High resolution stage with 0.5 μm repeatability

• Centric and Aplanatic Refractive Solid Immersion Lens (RSIL) option

• Techniques include a combination of:

• Laser Timing Probe (LTP)
• Scanning Optical Microscopy (SOM) with best sensitivity
• static: TIVA, OBIRCH
• dynamic: LADA, SDL
• Photon Emission Microscopy (PEM) with various options for the InGaAs or Si-CCD camera. Thermal Microscopy (THM) with InSb camera

Learn more here