ASAP-1 IPS

• Suits all sizes of die - package, wafer and board-level
• Full 100mm x 100mm stage area
• Always-On Real Time Video Monitor showing system and naviation parameters
• Touchscreen control with physical joystick & controls
• Rigid Table Assembly and closed-loop, high-torque, motor control enhances the machining of tough and hard materials
• X, Y and Z axes all have deep sub-micron accuracy
• Accurately decaps, then thins substrate and polishes
• Patented Floating Head provides a true polishing action -- yields polishing quality & high survivability
• Intuitive menus provide a powerful, easy to use, system
• USB Flash Drive interface for preparation recipe storage
• Short set-up and process times
• Accurate die-tilt adjustment ‘on the fly’
• Bench-top & Quiet in Operation

For more information go to http://www.ultratecusa.com/asap-1-ips